Misc:

3rd International Conference on Tangible and Embedded Interaction (TEI 2009)

Feb. 16, 2009 - Feb. 18, 2009, Cambridge, United Kingdom

http://tei-conf.org/

Deadlines

• Oct. 31, 2008
  Paper
• Nov. 27, 2008
  Acceptance Notification
• Nov. 30, 2008
  Acceptance Notification
• Dec. 15, 2008
  Camera Ready Copy
• Jan. 7, 2009
  Early Registration

Calls

• Call for Papers