THIRD INTERNATIONAL CONFERENCE ON TANGIBLE AND EMBEDDED INTERACTION 16-18 FEBRUARY 2009, CAMBRIDGE, UK SECOND CALL FOR PARTICIPATION http://tei-conf.org IMPORTANT DATES Submission deadline 31st Oct 08 Reviews due 27th Nov 08 Author notification deadline 30th Nov 08 Camera-ready copy deadline 15th Dec 08 Early registration deadline 7th Jan 09 Conference dates 16 - 18th Feb 09 KEYNOTE SPEAKERS delivered by Tom Igoe and Durrell Bishop. DESCRIPTION Computing is progressively moving beyond the desktop into new physical and social contexts. One key area of innovation has been around tangible computing, which pushes the user interface beyond the digital into the physical world by means of mobile devices, graspable interfaces, physical computing and interactive surfaces. A closely related topic is that of embedded interaction where the everyday objects and environments we interact with are computationally augmented in new ways. Designing such systems requires interdisciplinary thinking. Their creation must not only encompass software, electronics, and mechanics, but also the system\'s physical form and behaviour, and its social impacts. After the big success of TEI\'07 and TEI\'08 we are pleased to invite you to participate in TEI\'09 to present the latest results in tangible and embedded interaction. We invite submissions of work addressing HCI issues, design, user experience, tools and technologies, as well as interactive art in the broad area of tangible computing and embedded interactive systems. The intimate size of this single-track conference provides a unique forum for exchange of ideas through talks, interactive exhibits, demos, posters, art installations and performances. All accepted submissions will be included in the conference proceedings, which will be published through the ACM Digital Library. TOPICS FOR SUBMISSION Authors are invited to submit high-quality original work to advance the field. Appropriate topics include but are not limited to: * Examples of novel tangible interfaces or embedded interactive systems * Interactive uses of sensors and actuators, and electronics and mechatronics * Case studies and evaluations of working deployments * Relation of tangible and embedded interaction to other paradigms * Applied design in the form of concept sketches, prototypes and products * Programming paradigms and tools, toolkits, software architectures * Novel enabling technologies * Design guidelines and methods * Novel applications * Theoretical foundations, frameworks, and concepts * Philosophical, ethical and social implications * Usability * Provocative design work and interactive art SUBMISSION DETAILS Authors are invited to submit papers that are 2, 4, 6 or 8 pages long, formatted to follow the two column ACM SIGCHI format, and submitted electronically via the conference website. We are happy to consider a variety of styles for inclusion in the proceedings, such as academic papers, design sketches and descriptions of art pieces or installations. At the time of submission, authors will be able to specify their preferred format for presenting the work, which includes: * 15 minute talk * Interactive demo * 5 minute talk * Exhibit * Poster * Installation You can find more details on the submission requirements and review process online at http://tei-conf.org. ORGANIZING COMITTEE CONFERENCE CHAIRS Nicolas Villar Microsoft Research Cambridge, UK Shahram Izadi Microsoft Research Cambridge, UK PROGRAM CHAIRS Mike Fraser University of Bristol, UK Steve Benford University of Nottingham, UK SPONSORSHIP CHAIR Sriram Subramanian University of Bristol, UK PUBLICITY CHAIRS Jamie Zigelbaum MIT Media Lab, USA Florian Block Lancaster University, UK Nicolai Marquardt University of Calgary, Canada Takashi Matsumoto Pileus LLC, Japan DESIGN Bart Hengenveld Eindhoven University of Technology, NL Christian Zoellner UDK Berlin, Germany WEBMASTER Nicolai Marquardt University of Calgary, Canada PUBLICATION CHAIRS Dagmar Kern University of Duisburg-Essen, Germany Alireza Sahami University of Duisburg-Essen, Germany PROGRAM COMMITTEE Alan Blackwell University of Cambridge, UK Ali Mazalek Georgia Institute of Technology, USA Alissa Antle Simon Fraser University, Canada Andrew Smith Meraka Institute, South Africa Astrid Larssen University of Technology, Sydney Beat Signer ETH Zurich, Switzerland Boriana Koleva University of Nottingham, UK Bruce Thomas University of South Australia, Australia Chris Schmandt MIT Media Lab, USA Darren Edge Microsoft Research Beijing, China Denis Lalanne University of Fribourg, Switzerland Dzmitry Aliakseyeu Philips Research, NL Ehud Sharlin University of Calgary, Canada Elise van den Hoven TU Eindhoven, NL Ellen Do Georgia Institute of Technology, USA Florian Block Lancaster University, UK Floyd Mueller The University of Melbourne, Australia Giulio Jacucci HIIT, Finland Hans Gellersen Lancaster University, UK Hayes Raffle Nokia Research, USA Ivan Poupyrev Sony CSL, Japan Jon Hindmarsh King\'s College London, UK Jonna Häkkilä Nokia, Finland Karl-Petter Åkesson SICS, Sweden Kimiko Ryokai UC Berkeley, USA Kristina Andersen STEIM, NL Kristof Van Laerhoven TU Darmstadt, Germany Luigina Ciolfi University of Limerick, Ireland Mark Billinghurst HIT Lab, New Zealand Mark Gross Carnegie Mellon University, USA Michael Evans Virginia Tech, USA Miguel Nacenta University of Saskatchewan, Canada Morten Fjeld Chalmers University of Technology, SE Paul Holleis University of Duisburg-Essen, Germany Paul Marshall The Open University, UK Peter Krogh Aarhus School of Architecture, DK Sergi Jorda Universitat Pompeu Fabra, Spain Stefan Marti Samsung, USA Tom Gross Bauhaus-University Weimar, Germany Yoshifumi Kitamura Osaka University, Japan