From - Fri Oct 12 11:19:40 2001 Date: Fri, 12 Oct 2001 09:59:10 +0200 Organization: Institut fuer ComputerGraphik, TU Braunschweig Subject: [EG general] CFP: SOLID MODELING 2002 Given the recent developments in the world, several people have requested slightly more time to prepare their submissions to the ACM Solid Modeling Symposium'02. In order to accomodate this request, we have extended the abstract deadline from October 15 to October 31. The updated CFP is enclosed below. Call for Papers SOLID MODELING 2002 Seventh ACM Symposium on Solid Modeling and Applications Max-Planck-Institut für Informatik, Saarbrücken, Germany, June 17-21, 2002 Sponsored by ACM SIGGRAPH and EUROGRAPHICS The Solid Modeling symposia series is an international forum for the exchange of recent research and applications of solid modelling, shape modelling, and geometric computation in design, analysis and manufacturing, as well as in the emerging biomedical, geophysical and other areas. This highly successful symposium, which has been held bi-annually since 1991, brings together prominent researchers, key practitioners, and numerous students in the field. Starting in 2002, it will be held annually, alternating in location between the USA and the other countries with a two year period. The Solid Modeling 2002 symposium will be held at the Max-Planck-Institut für Infomatik, in Saarbrücken, Germany. In addition to technical papers in plenary sessions, the program for Solid Modeling 2002 will include: - academic and industrial tutorials - keynote lectures - panel sessions - best paper award at the symposium banquet - sponsorship of students to attend the symposium - social program More information on the symposium can be found on the Solid Modeling 2002 web page: http://www.mpi-sb.mpg.de/units/ag4/sm02/index.html The papers submission schedule is as follows: October 31, 2001: Abstracts due November 30, 2001: Full papers due February 28, 2002: Notice of acceptance and reviews March 31, 2002: Final camera-ready papers and extended abstracts due For details on how to submit abstracts and papers, please consult the web page. Abstracts are used to facilitate the review process and should be 150-300 words in length. Papers are limited to 12 typeset pages in length, including figures and references, and should present previously unpublished original results. All papers will be peer-reviewed and can be selected for presentation at a plenary session, or for presentation at a poster session, with publication in the conference proceedings published by ACM Press. A revised version of selected papers will also be published in special issues of the journal Computer Aided Design and of the ASME/ACM journal Computer and Information Science in Engineering (JCISE). The best paper award will be selected by a jury of experts and will be presented at the symposium banquet. Symposium Co-Chairs: Hans-Peter Seidel, Max Planck Institute, Saarbruecken, Germany Vadim Shapiro, University of Wisconsin, Madison, U.S.A. Program Co-Chairs: Kunwoo Lee, Seoul National University, Seoul, Korea Nick Patrikalakis, MIT, Cambridge, U.S.A. Topics of interest for Solid Modeling 2002 include, but are not limited to: Geometric and topological representations Multi-resolution models Heterogeneous models Geometric interrogations and reasoning Computational geometry Robustness of geometric computations Blends, sweeps, offsets & deformations Procedural, constraint-based and parametric modeling Feature-based modeling Conceptual design techniques Product and assembly modeling Representation conversion Product data exchange User interaction techniques Haptic interfaces Collaborative/distributed design Virtual environments and prototypes Reverse engineering Engineering analysis using solid models Engineering tolerances Manufacturing and assembly planning Computational support for new manufacturing technologies Biomedical applications Geoscience Entertainment applications