From - Thu Oct 11 11:35:30 2001
Date: Thu, 27 Sep 2001 14:00:25 +0200
Organization: Institut fuer ComputerGraphik, TU Braunschweig
Subject: [EG general] CFP: Solid Modeling 2002



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                     Call for Papers
                                          
                                          
                   SOLID MODELING 2002
        
  Seventh ACM Symposium on Solid Modeling and Applications

      Max-Planck-Institut für Informatik, Saarbrücken,
 
                Germany, June 17-21, 2002
   
         Sponsored by ACM SIGGRAPH and EUROGRAPHICS
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The Solid Modeling symposia series is an international forum for the
exchange of recent research and applications of solid modelling, shape
modelling, and geometric computation in design, analysis and
manufacturing, as well as in the emerging biomedical, geophysical and
other areas. This highly successful symposium, which has been held
bi-annually since 1991, brings together prominent researchers, key
practitioners, and numerous students in the field.  Starting in 2002,
it will be held annually, alternating in location between the USA and
the other countries with a two year period.  The Solid Modeling 2002
symposium will be held at the Max-Planck-Institut für Infomatik, in
Saarbrücken, Germany. In addition to technical papers in plenary
sessions, the program for Solid Modeling 2002 will include: - academic
and industrial tutorials - keynote lectures - panel sessions - best
paper award at the symposium banquet - sponsorship of students to
attend the symposium - social program More information on the
symposium can be found on the Solid Modeling 2002 web page:

http://www.mpi-sb.mpg.de/units/ag4/sm02/index.html


The papers submission schedule is as follows:

October 15, 2001:     Abstracts due
November 30, 2001:    Full papers due
February 28, 2002:    Notice of acceptance and reviews
March 31, 2002:       Final camera-ready papers and extended abstracts due


For details on how to submit abstracts and papers, please consult the
web page.  Abstracts are used to facilitate the review process and
should be 150-300 words in length. Papers are limited to 12 typeset
pages in length, including figures and references, and should present
previously unpublished original results. All papers will be
peer-reviewed and can be selected for presentation at a plenary
session, or for presentation at a poster session, with publication in
the conference proceedings published by ACM Press. A revised version
of selected papers will also be published in special issues of related
scientific journals. Best paper award will be selected by a jury of
experts and will be presented at the symposium banquet.


Symposium Co-Chairs:

Hans-Peter Seidel, Max Planck Institute, Saarbruecken, Germany
Vadim Shapiro, University of Wisconsin, Madison, U.S.A.


Program Co-Chairs:    

Kunwoo Lee, Seoul National University, Seoul, Korea
Nick Patrikalakis, MIT, Cambridge, U.S.A.


Topics of interest for Solid Modeling 2002 include, but are not limited to:

Geometric and topological representations
Multi-resolution models
Heterogeneous models
Geometric interrogations and reasoning
Computational geometry
Robustness of geometric computations
Blends, sweeps, offsets & deformations
Procedural, constraint-based and parametric modeling
Feature-based modeling
Conceptual design techniques
Product and assembly modeling
Representation conversion 
Product data exchange
User interaction techniques
Haptic interfaces
Collaborative/distributed design
Virtual environments and prototypes
Reverse engineering
Engineering analysis using solid models
Engineering tolerances
Manufacturing and assembly planning
Computational support for new manufacturing technologies
Biomedical applications
Geoscience
Entertainment applications