Date: Tue, 27 Jun 2000 16:38:17 +0200 To: abteilung@cg.tuwien.ac.at From: Abdelaziz BOURAS (by way of Werner Purgathofer ) Subject: SOLID MODELING 2001: Call for Papers                             Call for Papers                           SOLID MODELING 2001         Sixth ACM Symposium on Solid Modeling and Applications                    Sheraton Inn, Ann Arbor, Michigan                             June 4-8, 2001                       Sponsored by ACM SIGGRAPH The Solid Modeling symposia series is an international forum for the exchange  of recent research and applications of solid modeling in design, analysis and manufacturing, as well as in the emerging biomedical, geophysical and other areas. The 10th anniversary of this highly successful symposium, which has been held bi-annually since 1991, will again bring together prominent researchers, key practitioners, and numerous students in the field. Several leading-edge companies have already confirmed attendance including software exhibits. The Solid Modeling 2001 symposium will be held once again in the beautiful university town of Ann Arbor, Michigan, close to the U.S. automotive and manufacturing industries. In addition to technical papers in plenary sessions, the program for Solid Modeling 2001 will include:   o academic and industrial tutorials   o keynote lectures   o panel sessions   o best paper awards at the symposium banquet   o sponsorship of students to attend the symposium   o spousal program More information on the symposium can be found on the Solid Modeling'01 web page: http://www.engin. umich.edu/dept/meam/deslab/cadcam/ACMSM/ The papers submission schedule is as follows:   September 30, 2000: Abstracts due   October 30, 2000  :  Full papers due   January 31, 2001  :  Notice of acceptance and reviewers' comments   February 28, 2001 : Final camera-ready papers and extended                                   abstracts due For details on how to submit abstracts and papers, please consult the web page. Abstracts are used to facilitate the review process and should be 150-300 words in length. Papers should be at most 12 typeset pages, including figures and references, and should present previously unpublished original results. All papers will be peer-reviewed and can be selected for presentation at a plenary session with publication in the conference proceedings published by ACM Press, or for presentation at a poster session with publication of an extended two-page abstract in the conference proceedings. A revised version of selected  papers also will be published in a special issue of the journal Computer-Aided Design. The Best Paper Awards will be selected from the accepted papers by a jury and presented at the Symposium Banquet. Symposium Co-Chairs:    Deba Dutta, University of Michigan, Ann Arbor, U.S.A    Hans-Peter Seidel, Max Planck Institute, Saarbruecken, Germany Program Co-Chairs:    David Anderson, Purdue University, West Lafayette, U.S.A    Kunwoo Lee, Seoul National University, Seoul, Korea The Program Committee for Solid Modeling 2001 consists of:   Seth Allen, Spatial Technology Inc.   Cagatay Basdogan, NASA JPL   Adrian Bowyer, University of Bath   Wim Bronsvoort, Delft University of Technology   Beat Bruderlin, Technical University of Ilmenau   Pere Brunet, Polytechnic University of Catalonia   Byoung Choi, KAIST   Jack Chung, SDRC   Jonathan Corney, Heriot-Watt University   Richard Crawford, University of Texas   Gershon Elber, Technion   Chris Hoffmann, Purdue University   Scott Hollister, University of Michigan   Robert Joan-Arinyo, Polytechnic University of Catalonia   Myong-Soo Kim, Seoul National University   Rüdiger Klein, Daimler Chrysler   Dinesh Manocha, University of North Carolina   Nick Patrikalakis, MIT   Mike Pratt, RPI/NIST   Jarek Rossignac, Georgia Institute of Technology   Vadim Shapiro, University of Wisconsin-Madison   Paul Stewart, Ford Motor Company   George Turkiyyah, University of Washington   Fred Van Houten, University of Twente   Kevin Weiler, WEBSCOPE Inc.   Xiuzi Ye, Solidworks Corp. Topics of interest for SM-01 include but are not limited to:    Geometric and topological representations    Multi-resolution models    Heterogeneous models    Geometric interrogations and reasoning    Computational geometry    Robustness of geometric computations    Blends, sweeps, offsets & deformations    Procedural, constraint-based and parametric modeling    Feature-based modeling    Conceptual design techniques    Product and assembly modeling    Representation conversion    Product data exchange    User interaction techniques    Haptic interfaces    Collaborative/distributed design    Virtual environments and prototypes    Reverse engineering    Engineering analysis using solid models    Engineering tolerances    Manufacturing and assembly planning    Biomedical applications    Computational support for new manufacturing technologies    Geophysical and geographical applications    Entertainment applications