From: HWWS2000@gris.uni-tuebingen.de Date: Fri, 31 Dec 1999 20:16:43 +0100 (MET) To: helwig@cg.tuwien.ac.at Subject: Graphics Hardware 2000 - call for participation Graphics Hardware 2000 ====================== in cooperation with Eurographics and ACM SIGGRAPH (to be confirmed) Interlaken, Switzerland Monday and Tuesday, August 21-22, 2000 Graphics Hardware is a highly visible, established international forum for exchanging experience and knowledge related to computer graphics hardware. The workshop offers a unique perspective on graphics hardware by combining discussions and constructive critique of innovative concepts as well as product-level designs. The workshop is an inclusive forum for the entire graphics hardware community and brings together researchers, engineers, and architects. This year's workshop will be held in Interlaken, Switzerland, jointly with Eurographics 2000. Please visit our website at http://www.merl.com/hwws00/ Schedule -------- April 12 Deadline for paper submissions May 8 Notification of acceptance May 22 Camera-ready papers due July 12 Deadline for Hot 3D Systems submissions Aug 21-22 Workshop Traditional Papers Track ------------------------ We invite high-quality, original papers on all aspects of computer graphics hardware describing either proven and tested solutions or novel ideas and concepts. Possible topics include: Graphics accelerator architectures Performance issues Pixel operations and frame buffer techniques Multi-processor architectures for graphics Hardware support for image-based rendering Load balancing in graphics systems Expansion and acceleration of shading models Volume rendering architectures Space, screen, and model partitioning Hardware support for photorealism Media processors Exploitation of new memory technologies for 3D graphics Authors are invited to send papers electronically, in Adobe PDF format as an email attachment, to lastra@cs.unc.edu. Please limit the length to 10 typeset pages or 20 double-spaced pages. If electronic submission is not feasible, please send six copies of the paper to the address below. If you would like to send videotapes to accompany the paper, please make six copies and mail them to the address below. An effort should be made to include the segment in both PAL and NTSC on the same VHS tape, to ensure that it can be seen by all reviewers. Submission address: Anselmo Lastra Department of Computer Science CB 3175, Sitterson Hall University of North Carolina Chapel Hill, NC 27599-3175 USA Phone +919-962-1958 FAX +919-962-1799 Email: lastra@cs.unc.edu If you wish to send papers electronically, but via an alternate method such as ftp, please contact lastra@cs.unc.edu for instructions. Hot 3D Systems Track -------------------- We invite industry groups to present their latest and greatest 3D chips or system designs. Presentations should be technical, rather than marketing, and should focus on real products and their performance evaluation. Presentations should last approximately 20-25 minutes. Bound copies of the slides will be prepared for attendees, and presentation slides will be made available on the workshop web page after the workshop. Contributors are invited to send their presentation slides electronically, in Microsoft PowerPoint format, as an email attachment to bosch@us.ibm.com by July 12, 2000. If electronic submission is not feasible, please send a hardcopy of the slides to the address below. Submission address: Bengt-Olaf Schneider IBM T.J. Watson Research Center P.O. Box 218, Yorktown Heights NY 10598 U.S.A. Phone: +914-945-1585 Fax: +914-945-4297 E-mail: bosch@us.ibm.com The Workshop ------------ The workshop will take place in Interlaken, Switzerland in a hotel during Monday and Tuesday of Eurographics 2000 week. The workshop will feature two full days of paper and industry presentations and invited talks. We will continue the workshop's tradition of a sumptuous banquet at a unique location. Registration ------------ The registration fee (in US $) includes the workshop proceedings, banquet, coffee, and lunches. The workshop fee does not cover accommodations. Please see our website for full details on registration and accommodations. Best Paper Award ---------------- An award of $500 will be given to the authors of the paper considered to be the outstanding paper presented at the workshop. The award is based on the accuracy, originality, and importance of the technical concept, the quality and readability of the manuscript, as well as the content and delivery of the verbal presentation. To qualify for this award, one or more of the principal authors must be enrolled at the workshop and present the paper. The winner will be chosen by the organizing committee based on audience feedback and will be announced at the end of the workshop. Demonstrations -------------- Presenters and workshop participants are invited to bring prototypes or products for demonstration at the workshop. Demonstrations will be held on Monday and Tuesday during breaks and before and after workshop sessions. We highly encourage paper authors and industry presenters to demonstrate their systems at the workshop. Please contact the workshop chairs to arrange for space or electrical connections that may be required for your demonstration. For more information please visit http://www.merl.com/hwws00/ Organization ------------ Workshop Chairs: Bengt-Olaf Schneider - IBM T.J. Watson Research Center, USA Wolfgang Strasser - University of Tuebingen, Germany Program Chairs: Gunter Knittel - HP Labs Palo Alto, USA Hanspeter Pfister - MERL, USA Papers Chairs: Anselmo Lastra - UNC Chapel Hill, USA Ulrich Neumann - USC Los Angeles, USA Hot3D Chair: Bengt-Olaf Schneider - IBM T.J. Watson Research Center, USA Local Arrangements Chair: Roger Hersch - Ecole Polytechnique Federale de Lausanne (EPFL), Switzerland Publicity Chairs: Bartholt Lichtenbelt - 3Dlabs Fort Collins, USA Michael Doggett - University of Tuebingen, Germany Program Committee (to be confirmed) ----------------- K. Akeley, Silicon Graphics, USA D. Baldwin, 3Dlabs, UK A. Barkans, Microsoft, USA M. Cox, MRJ/NASA Ames and NVIDIA, USA F.C. Crow, Interval Research, USA N. England, University of North Carolina, USA H. Fuchs, University of North Carolina, USA P. Hanrahan, Stanford University, USA D. Jackel, University of Rostock, Germany K. Kiourcha, S3, USA D. Kirk, NVIDIA, USA F. Kitson, HP Labs, USA A.A.M. Kuijk, CWI, Netherlands P. Leray, CCETT, France P. Lister, Sussex University, UK R. Maenner, University of Mannheim, Germany T. Malzbender, HP Labs, USA M. Meriaux, University of Poitiers, France F.J. Peters, Philips Research, Netherlands A. Schilling, University of Tuebingen, Germany C. Shaw, University of Regina, Canada